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Xilinx and TSMC Reach Volume Production on all 28nm CoWoS(TM)-Based All Programmable 3D IC ...
Xilinx and TSMC Reach Volume Production on all 28nm CoWoS(TM)-Based All Programmable 3D IC ...
2013-10-21 06:00:00| Industrial Newsroom - All News for Today
Proven CoWoS™ technology to scale with Xilinx's 20SoC and 16FinFET 3D ICs<br /> <br /> SAN JOSE, Calif. and HSINCHU, Oct - Xilinx Inc. (NASDAQ: XLNX) and TSMC (TWSE: 2330, NYSE: TSM) today announced production release of the Virtex®-7 HT family, the industry's first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC's Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that ...This story is related to the following:Gate Arrays |
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Category:Industrial Goods and Services