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Low-Alloy Cellulosic Electrode suits root pass welding.

2013-08-26 14:32:07| Industrial Newsroom - All News for Today

Available in 4.0 mm, 3/16 in., and 5.0 mm dia, Pipeliner® Arc 80 is designed for root pass welding up to X80-grade pipe as well as fill and cap pass welding for X70-grade pipe. Low-alloy stick electrode, classified as E8010-G and E8010-P1 per AWS, fosters productivity in vertical down as well as out-of-position pipe welding and offers deep penetration. Q2 Lot® control shows actual deposited chemistry, and electrode offers clean, visible weld puddle.<br /> This story is related to the following:Welding Wire |

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Congress Is Less Popular than Cockroaches, Lice, Root Canals, Colonoscopies, Genghis Khan ...

2013-07-15 01:04:15| Auto Dealers - Topix.net

A June Gallup poll [showed that Congress] had a 10% approval rating [while] and one in March that showed North Korea with a 12% favorability rating among Americans.

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Edible forest garden taking root along polluted river in Ohio; healthy goals for people, too

2013-07-08 14:59:12| Chemicals - Topix.net

Berry bushes and squash vines, apple and pear saplings, and inches-high corn plants growing now are envisioned to blossom into an "edible forest garden" in urban Cincinnati for the benefit of joggers, bicyclists, hikers and those who simply want to relax along a waterway.

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The Strain in Spain Could Help Firefox OS Take Root

2013-07-01 22:12:43| TechNewsWorld

The ZTE Open -- the first commercially available smartphone running Mozilla's Firefox OS -- will be launched in Spain Tuesday by Telefónica. It will be available for about $90, with prepaid customers getting a balance of roughly $40 worth of phone calls. Telefónica will launch Firefox OS smartphones in Colombia and Venezuela soon, and will unveil other Firefox OS devices later this year.

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Wafer Analysis System quickly diagnoses root cause of defects.

2013-06-13 14:32:33| Industrial Newsroom - All News for Today

With automated front opening universal pod, Helios NanoLab&trade; 1200AT DualBeam&trade; System can be located inside semiconductor wafer lab, where SEM imaging and focused ion beam milling are used to extract ultrathin samples of targeted structures for examination in TEM. System can create site-specific TEM samples thin enough to capture single transistor at 10 nm node, from wafers up to 300 mm in diameter. By moving 1200AT close to wafer process line, process development and ramp are accelerated. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Wafer Inspection Systems |

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