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UK Can Makers introduces online 3D packaging design app

2013-09-10 01:00:00| Packaging Gateway

The UK Can Makers has introduced CanCreator, the first free online 3D packaging design app for drinks cans.

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Via-Filling Process promotes 3D-IC/TSV packaging reliability.

2013-09-09 14:30:32| Industrial Newsroom - All News for Today

Available on EVG100 resist processing systems, NanoFill™ polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. This suits polymeric dielectrics, offering flexible, production-ready platform for interposer development. Without forming voids or cavities, solution provides complete via filling for permanent passivation and planarization. Sidewall passivation option lends to throughput benefits for select applications. This story is related to the following:Void Fillers

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PrintSure Digital Packaging purchases Xeikon press

2013-09-09 07:00:00| Label and Narrow Web Breaking News

The Illinois-based company specializes in short-run prototypes, samples and displays.

Tags: press digital packaging purchases

 

Hotpack Packaging to open integrated manufacturing facility in Dubai

2013-09-09 01:00:00| Packaging Gateway

Dubai-based disposable food packaging materials manufacturer Hotpack Packaging will open an AED100m ($27m) integrated manufacturing and logistics complex in Dubai Investments Park, Jebel Ali.

Tags: open manufacturing integrated facility

 

Linpac Packaging adds new products to Freshware range

2013-09-06 01:00:00| Packaging Gateway

UK-based multi-material packaging manufacturer Linpac Packaging has added new products to its Freshware range for the sweet and savoury food sector.

Tags: products range packaging adds

 

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