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Abracon Releases The AMCA Series Of High Performance, Multilayer Chip Antennas In Six Different Sizes In Low Profile Packaging
2013-11-22 02:29:04| rfglobalnet News Articles
A globally preferred, leading supplier offrequencycontrol,magnetic and RF components,Abracon Corporation introduces its new range of chip antennas comprising the AMCA31, AMCA52, AMCA62, AMCA72, AMCA81 and AMCA92 series
Abracon Releases The AMCA Series Of High Performance, Multilayer Chip Antennas In Six Different Sizes In Low Profile Packaging
2013-11-22 02:29:04| wirelessdesignonline News Articles
A globally preferred, leading supplier offrequencycontrol,magnetic and RF components,Abracon Corporation introduces its new range of chip antennas comprising the AMCA31, AMCA52, AMCA62, AMCA72, AMCA81 and AMCA92 series
Qualcomm announces the Snapdragon 805, an ARM chip ready for a 4K world
2013-11-20 19:27:08| Extremetech
Qualcomm isn't content to rest on its laurels with the Snapdragon 800. It's already sampling the next-generation Snapdragon 805 with support for 4K video and even faster ARM cores.
Qualcomm Technologies Announces Fourth-Generation 3G/LTE Multimode Modem and RF Transceiver Chip
2013-11-20 06:00:00| Industrial Newsroom - All News for Today
- Latest Modem Technology Is First Commercial Solution to Offer Global 4G LTE Advanced 40 MHz Carrier Aggregation for FDD and TDD with Download Speeds of up to 300 Mbps -<br /> <br /> NEW YORK – Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., introduced its fourth-generation 3G/LTE multimode solutions with the newest modem chipset, the Qualcomm® Gobi™ 9x35, and RF transceiver chip, the Qualcomm WTR3925, designed for ...This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!Search for suppliers of: Chip Sets |
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Intel rushes to exascale with redesigned supercomputing chip
2013-11-19 19:19:46| InfoWorld: Top News
In the rush to exascale computing, Intel is making a small change that could have a big impact on system design with its upcoming Xeon Phi chip. Intel on Tuesday promised big performance and power improvements with the redesigned chip, code-named Knights Landing, which analysts said could ship next year or 2015. The chip will also have interconnect and memory advances, Intel has said, that could separate it from other co-processors like graphics processors, which are widely used to accelerate technical computing.
Tags: intel
chip
redesigned
rushes
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