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IBM z14 Mainframe CPUs to Use 14nm FinFET SOI Design
2017-09-25 13:30:23| Extremetech
IBM and GlobalFoundries are teaming up to build 14nm products using FinFETs and SOI. This is the first time we've seen both technologies deployed side-by-side on the same silicon. The post IBM z14 Mainframe CPUs to Use 14nm FinFET SOI Design appeared first on ExtremeTech.
CWS Launches SiPEX, A Productivity Tool For RF SOI Designs
2016-03-17 02:55:45| rfglobalnet Home Page
Coupling Wave Solutions, S.A. (CWS), a leader in solutions for interference analysis in complex chip designs incorporating RF and analog blocks, recentlyannounced the availability of a new productivity tool called SiPEX
Tags: tool
designs
productivity
launches
CWS Launches SiPEX, A Productivity Tool For RF SOI Designs
2016-03-17 02:55:45| electronicsweb News Articles
Coupling Wave Solutions, S.A. (CWS), a leader in solutions for interference analysis in complex chip designs incorporating RF and analog blocks, recentlyannounced the availability of a new productivity tool called SiPEX
Tags: tool
designs
productivity
launches
MagnaChip To Offer High Performance And Cost Competitive 0.13 Micron 1.5/2.5V RF SOI Process
2016-01-05 07:06:38| rfglobalnet Home Page
MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE:MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a high performance and cost competitive 0.13 micron 1.5/2.5V RF Silicon on Insulator (SOI) process.
MagnaChip To Offer High Performance And Cost Competitive 0.13 Micron 1.5/2.5V RF SOI Process
2016-01-05 07:06:38| wirelessdesignonline News Articles
MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE:MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a high performance and cost competitive 0.13 micron 1.5/2.5V RF Silicon on Insulator (SOI) process.