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BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
2014-02-26 14:30:44| Industrial Newsroom - All News for Today
RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter. Both BGA socket and adapter are constructed with polyimide and FR-4 body. This story is related to the following:Ball Grid Array (BGA) Sockets |
Swivel Lid Spring Pin BGA Socket supports geometric processors.
2014-02-17 14:30:38| Industrial Newsroom - All News for Today
Designed for testing 10 x 8 mm, 0.5 mm pitch, 223-position, 15 x 19 ball array packages, Model SBT-BGA-7019 features stamped spring pin contactor with 31 g actuation force per ball and cycle life of 125,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 30°C temperature rise. Mounted using supplied hardware on PCB with no soldering, socket features temperature range of -55 to +180°C. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Test Sockets |
BGA Socket Adapter serves 8 Mb Flash memory applications.
2013-11-06 14:29:37| Industrial Newsroom - All News for Today
Giga-snaP™ BGA socket adapter pair – SF-BGA48U-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin adapter – allows 0.8 mm pitch, 8 x 6 mm body, 8 x 6 array Flash memory to be socketed in CMOS applications. BGA adapter, to which target 48 ball flash memory chip or other compatible chip is attached, plugs into female BGA socket on board. Electrical path of adapters has physical length of 4.5 mm, promoting high frequency signal transmission. This story is related to the following:Ball Grid Array (BGA) Sockets |
Tags: flash
applications
memory
serves
PCIe to MIL-STD-1553 BGA Package conserves space, power.
2013-07-31 14:33:12| Industrial Newsroom - All News for Today
Within single BGA device with PCIe host interface, 15 x 20 mm PCIe-Express AceXtreme® (BU-67302B0C0L-202) provides dual MIL-STD-1553 transceivers, protocol, and 64K x 36 of internal memory. Component can serve applications from -40 to +85°C and provides dual redundant MIL-STD-1553 channel with less than 1.1 W power dissipation @ 50% duty cycle. Other features include IEEE 1149.1-compliant JTAG test interface, digital IRIG-B input, and 8 digital discrete I/O lines. This story is related to the following:Test and Measuring InstrumentsControls and ControllersConverters | Interfaces | Transceivers | VME Interface Boards |
Tags: power
space
package
pcie
Lever Lid BGA Socket connects all pins with 40 GHz bandwidth.
2013-06-05 14:28:07| Industrial Newsroom - All News for Today
Accommodating 35 x 35 mm, 1 mm pitch BGA packages, SM-BGA-9032 operates at bandwidths up to 40 GHz with less than 1 dB insertion loss. Mounting on target PCB is accomplished without soldering, and construction features lever-actuated clamshell lid that incorporates quick insertion method. Constructed with elastomer contactor, socket operates from -55 to +150°C and is designed for low wattage dissipation with compression screw. Pin self inductance is 0.10 nH, and mutual inductance is 0.007 nH. This story is related to the following:Ball Grid Array (BGA) Sockets |
Tags: lid
ghz
bandwidth
socket