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Tag: bga
BGA Interposer probes DDR4 x16 designs with logic analyzer.
2015-02-24 14:30:39| Industrial Newsroom - All News for Today
Used for testing DDR4 x16 DRAM designs with U4154B logic analyzer, W4631A captures address, command, and data signals for debugging designs and making validation measurements. Solution connects directly to balls of DRAM with DDR4 96 ball riser (included) or optional 3rd party socket, enabling operation and acquisition with minimal impact to signal integrity on embedded system design. Interposer can be used with E5849A probes for high-data-rate (up to 3.2 Gbps) DDR4 DRAM designs.
Tags: designs
logic
analyzer
probes
USB 3.0 Hub Controller comes in 6 x 6 mm BGA package.
2014-12-29 14:32:22| Industrial Newsroom - All News for Today
Intended for mobile and consumer devices, EZ-USB® HX3™ offers full configurability via I²C EEPROM, I²C Slave, and GPIO options. Ghost Charging allows device charging without host, and Accessory Charger Adaptor Dock enables upstream charging for portable devices with USB OTG host. Other features include Shared Link, which enables up to 8 downstream ports; support for USB-IF Battery Charging v1.2 specification and charging of Apple devices; as well as configurable USB 2.0 and SuperSpeed PHYs.
BGA Socket accommodates hybrid memory cube.
2014-12-15 14:32:34| Industrial Newsroom - All News for Today
Operating at bandwidths up to 8 GHz with less than 1 dB of insertion loss, Model SG-BGA-6412 is designed for 31 x 31 mm Hybrid Memory Cube with 1 mm pitch and 900-pin BGA. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Mounted on target PCB with no soldering, socket features contact resistance of 20 mΩ per pin, current capacity of 2 A per pin, and temperature range of -35 to +100°C.
Tags: memory
hybrid
cube
socket
BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.
2014-12-04 14:30:49| Industrial Newsroom - All News for Today
Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target PCBs and preventing failures that occur with CTE mismatch.
Tags: accepts
adapter
ic
pitch
DDR3 SDRAM Socket accepts 0.8 mm pitch, 96-pin BGA ICs.
2014-09-16 14:30:44| Industrial Newsroom - All News for Today
Able to socket 8 x 14 mm, 7.5 x 13 mm, 9 x 13 mm, and 9 x 16 mm ICs with BGA package on any PCB without any soldering, SG-BGA-6410 operates at bandwidths up to 8 GHz with less than 1dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Footprint adds 2.5 mm on each side, and construction includes shoulder screw and swivel lid. Latter incorporates quick insertion method to accelerate IC changeout. This story is related to the following:Printed Circuit Sockets | Ball Grid Array (BGA) Sockets
Tags: accepts
pitch
socket
ics