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Rework Solder Paste desolders Pb-free components.
2014-09-30 14:33:37| Industrial Newsroom - All News for Today
With desoldering temperature of 180°C, RoHS-compliant Bi Rework Solder Paste provides optimized removal of through-hole and SMT components, including LEDs. No-clean, halide-free flux minimizes risk of board damage during desoldering process. In addition, product offers easy dispensing and clean-up. This story is related to the following:Solder Paste | No Clean Flux |
Tags: components
paste
solder
rework
Solder Joint Encapsulant for Ball Bumping Applications: BP 256
2014-09-22 06:00:00| Industrial Newsroom - All News for Today
Albany, NY – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.<br /> <br /> YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. ...This story is related to the following:Adhesives and SealantsSearch for suppliers of: Reflow Encapsulants |
Tags: applications
ball
joint
solder
Metcal and Kester Solder to Hold Rework Workshop
2014-09-01 06:00:00| Industrial Newsroom - All News for Today
GARDEN GROVE, CA – Metcal today announced that it will hold its next rework workshop in conjunction with Kester Solder. The workshop is scheduled to take place Tuesday, October 7, 2014 at the Double Tree Hotel in Thornton, CO. The workshop will provide tips to unlock the latest rework challenges.<br /> <br /> Experts from Metcal and Kester Solder will discuss applications and rework approaches for BGA, PoP, QFN, QFP, 0201, LED and PTH. The workshop will include multi-media presentations, ...
Tags: hold
workshop
solder
rework
Indium Corporation Features RMA-155 Pb-Free Solder Paste at SMTAi
2014-08-28 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature its new Pb-free solder paste, RMA-155, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.<br /> <br /> RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation ...This story is related to the following:Flux Cored Wire | Soldering Flux
Tags: features
corporation
paste
solder
World's First SMT Assembler with Integrated Solder Paste Jet Printer at SMTAI
2014-08-27 06:00:00| Industrial Newsroom - All News for Today
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it will highlight the Paraquda 2 with integrated solder paste jet printer in Booth #640 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Essemtec has merged its dispensing and pick-and-place know-how from the Scorpion and Paraquda machines into a SMT production centre.<br /> <br /> Paraquda combines two ...This story is related to the following:Materials and Material ProcessingSurface Mount Technology (SMT) Screen Printers | Surface Mount Assembly Equipment
Tags: printer
integrated
jet
paste
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