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MACOM Extends X-Band Leadership With High Power Switch In HMIC Silicon PIN Diode Technology
2014-03-04 02:46:19| rfglobalnet News Articles
M/A-COM Technology Solutions Inc. (“MACOM”) a leading supplier of high performance analog RF, microwave, and millimeter wave products, recently announced a new 20 W Pin-diode switch suited for high power X-Band applications.
Tags: high
power
technology
switch
Westport and Delphi sign joint development agreement to commercialize natural gas injector technology for heavy-duty applications
2014-03-03 18:30:20| Green Car Congress
Tags: sign
technology
development
agreement
Automakers tap smartphone technology in battle over city cars
2014-03-03 16:09:34| Electronics - Topix.net
Carmakers are tapping smartphone technology to spruce up low-cost city cars and try to get an edge in a market that has grown to account for almost 10 percent of new car sales in austerity-scarred Europe.
Tags: city
technology
cars
battle
BC Engineering and Design now State of the Art Technology for to Enable Facility Imaging
2014-03-03 06:00:00| Industrial Newsroom - All News for Today
As-built Plant Documentation - BC Engineering and Design has the latest technology to document your facility quickly and accurately in 3D point cloud scans.<br /> <br /> Using a FARO® Laser Scanner, engineers can develop 3D scans and images which can be imported into 3D CAD programs. An accurate virtual model can be made to show current equip-ment, piping, and structural arrangements. If modifications are planned, the virtual model can be modified to show the planned modifications. Plan and ...This story is related to the following:Computer Hardware and PeripheralsEngineering Services | 3D Laser Scanning Systems | Laser Scanners
Geometry Comparison Technology from LEDAS Embeds ASCON C3D Kernel
2014-03-03 05:00:00| Industrial Newsroom - All News for Today
Geometry Comparison Technology from LEDAS<br /> Integrated with ASCON C3D Kernel<br /> First Third-Party Component Technology to Benefit from C3D<br /> <br /> St. Petersburg and Novosibirsk, Russia - LEDAS Ltd. and ASCON today jointly announced the successful integration of ASCON's C3D kernel into LEDAS Geometry Comparison technology. This is the first third-party component to benefit from the C3D kernel; previously, third parties had only developed CAD/CAM software as applications on top of ...This story is related to the following:CAE Software | CAD/CAM Software
Tags: technology
comparison
kernel
geometry
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