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Amkor Technology Takes Leadership Position In Advanced System-In-Package Market

2016-03-29 07:19:31| rfglobalnet Home Page

Amkor Technology Inc., a leading semiconductor packaging and test service provider, recently announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions.

Tags: advanced technology market position

GigOptix Announces Leadership Position In Point-To-Point Wireless Backhaul Market With Delivery Of E-Band Radio SIPs

2016-03-29 07:01:37| rfglobalnet Home Page

GigOptix, Inc., a leading supplier of advanced semiconductor communications components for use in Cloud connectivity, data centers, and high-speed optical and wireless networks, recently announced leadership position in point-to-point (PtP) wireless backhaul with delivery of high performance E-Band radio system in package (SIP) products.

Tags: market position radio delivery