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Tag: fanout
Cadence Announces Availability Of Complete IC Packaging Design And Analysis Solutions For Advanced Fan-Out Wafer-Level Chip Scale Packaging
2016-03-15 08:53:45| wirelessdesignonline News Articles
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry's only foundry-proven IC packaging design and analysis solutions for advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.
Tags: advanced
design
complete
analysis
Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
2016-02-05 11:31:09| Industrial Newsroom - All News for Today
Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep Lithography System for the...
Tags: system
line
selected
panel
Ultratech Receives Large Multiple System Order for Fan-Out Wafer-Level Packaging Application
2015-10-20 12:31:11| Industrial Newsroom - All News for Today
Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application SAN JOSE, Calif., Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs...
Tags: order
system
large
application
Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
2015-07-14 12:31:14| Industrial Newsroom - All News for Today
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300...
Tags: order
system
level
applications
Rudolph Receives JetStep Lithography System Order From Leading OSAT For Copper Pillar Bump And Fan-Out Wafer Level Packaging Applications
2015-07-10 03:23:23| metrologyworld Home Page
Rudolph Technologies, Inc. announced recently that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300 Advanced Packaging Lithography System for the development of next-generation advanced packaging technology
Tags: order
system
level
applications