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High-Resolution Camera Module has low-profile design.

2013-04-10 14:28:19| Industrial Newsroom - All News for Today

Targeting next-generation, ultra-thin smartphones and tablet devices, TCM9930MD uses flip-chip structure for image sensor. Integrated image pre-processing LSI (companion) chip provides distortion correction and performs image resolution reconstruction, resulting in CMOS image sensor camera module with 13 MP imaging capabilities and 4.7 mm profile. This story is related to the following:Optics and PhotonicsServicesSearch for suppliers of: High Resolution Cameras | Cameras |

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04.10.13 -- Camera System Creates High-Resolution 3D Images From Up To A Kilometer Away

2013-04-09 02:17:36| metrologyworld News Articles

04/10/13 Metrology World.com Newsletter

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Display Processor supports high-resolution video walls.

2013-04-08 14:24:56| Industrial Newsroom - All News for Today

With up to 16 inputs and 16 outputs, OmniWall™ is suited for 2 x 2, 3 x 3, or 3 x 4 screen arrays, or linear configurations from 1 x 16 to 16 x 1. For larger video walls, OmniWall 32 offers up to 32 input and 32 outputs. Multiple chassis can be connected in parallel for even larger walls. System supports DVI resolutions up to 1,920 x 1,200, and 4K (UltraHD) up to 4,096 x 2,160. HDCP compliance allows processor to accommodate content-protected HDMI signals and provide embedded audio pass-through. This story is related to the following:Computer Hardware and PeripheralsSearch for suppliers of: Video Signal Processors

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New Camera System Creates High-Resolution 3-D Images From Up To A Kilometer Away

2013-04-04 11:50:00| metrologyworld News Articles

A standard camera takes flat, 2-D pictures. To get 3-D information, such as the distance to a far-away object, scientists can bounce a laser beam off the object and measure how long it takes the light to travel back to a detector

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New Camera System Creates High-resolution 3-D Images from up to a Kilometer Away

2013-04-04 06:00:00| Industrial Newsroom - All News for Today

A research team, led by Gerald Buller, a professor at Heriot-Watt University in Edinburgh, Scotland, describes a time-of-flight imaging system that can gather high-resolution, 3-D information about objects from up to 1 km away. System works by sweeping low-power IR laser beam rapidly over object. It then records round-trip flight time of photons in beam as they bounce off object and arrive back at source. Research paper can be found in OSA's open-access journal Optics Express. This story is related to the following:Trade Associations

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