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EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution
2014-07-18 10:37:01| electronicsweb Home Page
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled theGEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs)
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manufacturing
Ford Fusion Rear Window in Lightweight Concept Version Loses 35 Percent of Its Weight with ...
2014-07-17 06:00:00| Industrial Newsroom - All News for Today
With the automotive industry focused on hitting future fuel economy and emission targets, the Ford Motor Company has revealed a drivable multi-material lightweight vehicle (MMLV) with an advanced polycarbonate (PC) glazing solution from SABIC’s Innovative Plastics business that makes possible a 35 percent weight reduction compared to the same window on a 2013 model year Ford Fusion production vehicle. The weight savings total 7.4 pounds, even though the rear window is over one millimeter ...This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Thermoplastic Materials
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Monster High: Freaky Fusion Coming to DVD, Blue-Ray & Digital HD This September
2014-07-09 21:20:05| Toys - Topix.net
While attempting to help Frankie Stein learn more about her freaky cool scaritage, the fashionably fierce ghoulfriends travel back in time to the first day ever at Monster High! There, they meet Sparky, who has an obsession for creating life.
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
2014-07-08 14:31:19| Industrial Newsroom - All News for Today
GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Bonding Machinery
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Able Planet Linx Fusion
2014-07-02 20:37:38| PC Magazine: New Product Reviews
The Able Planet Linx Fusion headphone pair feels a bit like a science experiment, blending skin- and bone-conduction audio with conventional drivers and noise cancellation, and the results are flawed but fascinating.
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