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LPKF Introduces New PCB Milling Machine With UV Laser

2013-11-27 03:52:07| rfglobalnet News Articles

Circuit board plotters in the LPKF ProtoMat range previously cut out circuit structures from completely coated base materials using negative milling. The ProtoMats mill insulation channels into the conductive layer, leaving the areas that will later be the conductive traces.

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Epilog Laser Releases First-Ever Mac-Compatible Laser System Driver For Fusion Laser System

2013-11-26 03:51:00| fiberopticsonline News Articles

Epilog Laser, the leading producer of CO2 and fiber laser engraving, cutting and marking systems, is excited to announce the company has developed a Mac driver for the Fusion Laser Series. Epilog is the first laser system manufacturer to make this technology available to customers and users

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SUSS MicroTec Installs ELP300 Excimer Laser Stepper At Fraunhofer IZM Berlin

2013-11-21 07:37:58| chemicalonline News Articles

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

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Nd: YAG Laser Filters achieve >90% transmission in pass band.

2013-11-20 14:29:30| Industrial Newsroom - All News for Today

For applications using multi-line or multiple Nd: YAG lasers, TECHSPEC® OD 6 Multi-Notch Filters provide transmission and rejection necessary to isolate narrow spectral regions. Transmission range is 325–1,200 nm, blocking is >6.0 optical density at specified laser wavelength, and fabrication with hard coated plasma deposition technology lends to durability. Filters come in 12.5, 25, and 50 mm dia with center wavelengths of 355 and 532 nm, 355 and 1,064 nm, as well as 355, 532, and 1,064 nm. This story is related to the following:Bandpass Filters |

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SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM Berlin

2013-11-20 06:00:00| Industrial Newsroom - All News for Today

Garching – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing and processing of 100mm to 300mm wafers. The platform ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdWafer Processing Systems | Laser Machining |

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