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Dell profit sinks 31 percent as company fights to go private

2013-02-20 13:25:35| InfoWorld: Top News

Dell has reported another quarter of declining revenue and profit as the company's CEO continues his battle to take the PC maker private. It was the fifth consecutive quarter in which Dell's profits shrank, and the fourth in which it reported declining revenue. The company has been hit by a downturn in the PC market.

Tags: go company private dell

 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| electronicsweb Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 
 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| rfglobalnet Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| dairynetwork Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 

Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series

2013-02-13 12:25:14| electronicsweb Downloads

The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).

Tags: low series height heat

 

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