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NAStar releases temporary adhesive demo video

2014-02-04 06:00:00| Label and Narrow Web Breaking News

T1055 Temporary Adhesive removes cleanly from glass yet also adheres to wood as well as cold, damp, and frosted surfaces.

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Silver-Filled Epoxy Adhesive suits applications up to 480°F.

2014-01-31 14:31:50| Industrial Newsroom - All News for Today

Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP. This story is related to the following:Epoxies | Electrically Conductive Adhesives

Tags: applications suits adhesive epoxy

 
 

Kraton Executive Joins Adhesive and Sealant Council Board

2014-01-27 06:00:00| Industrial Newsroom - All News for Today

ASC announces that Mark Plante, Director, North American Sales at Kraton, will join its Board of Directors effective immediately. Mark Plante is currently the North American Commercial Director for Kraton’s Adhesives, Sealants and Coatings division. He has been with Kraton for over 3 years, managing the sales and commercial aspects of business in North and South America. Prior to Kraton, Mark spent 8 years in Avery Dennison’s Performance Polymers Division as Global Sales ...This story is related to the following:Trade Associations

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BAL Sticks with RPC Oakham for Adhesive Launch

2014-01-23 06:00:00| Industrial Newsroom - All News for Today

A renowned tile adhesive from market leader BAL is now better than ever - in a container from RPC Containers Oakham.<br /> <br /> BAL remains the only brand of choice for thousands of professional tilers, with a reputation built through a half-century of innovation. Market leader since 1963, it has created some of the UK's most popular adhesives, including the trusted White Star.<br /> <br /> Now, following intensive research and development in conjunction with fixers and contractors across ...This story is related to the following:Containers

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Epoxy Adhesive suits microelectronic assembly applications.

2014-01-14 14:30:45| Industrial Newsroom - All News for Today

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. This story is related to the following:Epoxy Adhesives

Tags: applications assembly suits adhesive

 

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