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Tag: filling
Additive for Copper Plating is suited for TSV filling.
2013-10-22 14:29:43| Industrial Newsroom - All News for Today
Single-component type additive for TSV (Through Silicone Via) copper plating aids semiconductor manufacturers stacking multiple chips into 3D structure. Bottom-up filling (copper deposition progress from bottom of via) avoids occurrence of defects in filled copper. Effective with TSVs of various sizes, additive is also effective with via holes of different sizes on same wafer. Perfect filling has been confirmed for range of via sizes, from 5–20 µm dia, and aspect ratios of 1 to 10. This story is related to the following:Additives
Tags: filling
copper
suited
additive
Vetter to upgrade filling production facilities
2013-10-11 01:00:00| Packaging Gateway
Vetter is executing a project to expand and upgrade its filling production facilities located in Germany and the US with an investment of over $100m.
Tags: production
facilities
upgrade
filling
Bulk Bag Filling System serves ultra-heavy-duty applications.
2013-10-04 14:29:39| Industrial Newsroom - All News for Today
Flexicon® Bulk Bag Filling System handles aggregates, abrasive minerals, powdered metals, dry chemical additives, filter press cake, and other difficult-to-handle bulk materials. Along with Twin-Centerpost™ frame and integral flexible screw conveyor, skid-mounted system features forklift fill head height adjustment, feed chute outlet port, and several automated functions: inflatable collar, vibratory densification/deaeration system, and pneumatically retractable bag hooks. This story is related to the following:Bulk Bag Filling Machinery
Tags: system
applications
bag
serves
IDC/Cryovac SpeedFlex Bag-In-Box Filling Machine Makes Industry Debuts
2013-10-04 06:12:37| dairynetwork Home Page
It is a rare occurrence in any industry when a new innovation increases productivity by three to four times
Tags: makes
industry
machine
filling
T.H.E.M. Demonstrates the Sanko FR-3 Pouch Filling Machine to Attendees at Pack Expo 2013, Las ...
2013-10-01 07:00:00| Industrial Newsroom - All News for Today
Marlton, NJ — Technical Help in Engineering and Marketing (T.H.E.M.), a leading provider of flexible packaging solutions, and the exclusive North American representative for Sanko packaging machinery, recently showcased the Sanko FR-3 Pouch Filler at Pack Expo 2013. "Our booth was mobbed from start to finish," commented an excited T.H.E.M. CEO and President, Neil Kozarsky. A wide range of food, beverage and personal care brand executives were literally lined up for a first-hand ...This story is related to the following:Pouch Packaging Machinery
Tags: las
machine
pack
filling
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