Home nanoelectronics
 

Keywords :   


Tag: nanoelectronics

Solmates Secures Key Order For Its PLD Equipment From Leading Nanoelectronics Research Center Imec

2016-04-19 06:28:38| rfglobalnet Home Page

Solmates has received an important and high profile order for its Pulsed Laser Deposition (PLD) equipment from world–leading nanoelectronics research center imec. The system is scheduled for delivery to imec in Leuven, Belgium during Q2 2016.

Tags: order center research key

 

University Of Colorado And SRC Research Accelerates Microscopic Imaging For Next-Generation Nanoelectronics

2015-09-11 04:00:43| metrologyworld Home Page

University of Colorado researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductor technologies, have developed new microscopic imaging techniques to help advance next-generation nanotechnology in applications ranging from data storage to medicine

Tags: research university colorado src

 
 

07.21.15 -- Breaking The Terahertz Barrier For Graphene Nanoelectronics

2015-07-20 04:01:28| rfglobalnet Home Page

07/21/15RF Globalnet Newsletter

Tags: breaking barrier nanoelectronics terahertz

 

On The Way To Breaking The Terahertz Barrier For Graphene Nanoelectronics

2015-07-16 09:12:04| rfglobalnet Home Page

Mainz/Barcelona. A team of scientists at the Max Planck Institute for Polymer Research (MPI-P) discovered that electrical conduction in graphene on the picosecond timescale – a picosecond being one thousandth of one billionth of a second – is governed by the same basic laws that describe the thermal properties of gases.

Tags: breaking barrier nanoelectronics terahertz

 

Resist Processing System supports micro- and nano-electronics.

2013-05-17 14:31:22| Industrial Newsroom - All News for Today

Featuring robot with dual arms for accelerated wafer swapping, EVG®120 Automated Resist Processing System supports coating and developing applications for MEMS systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers up to 200 mm in diameter, EVG120 includes CoverSpin™ rotating bowl cover for coating uniformity across substrate. This story is related to the following:Printing and Duplicating EquipmentWafer Processing Systems | Lithography Machinery |

Tags: system processing micro supports

 

Sites : [1] [2] next »