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Spectrum's Latest XMC-8320 Dual Multicore DSP Processing Module Features TI's Fixed-Point And Floating-Point C6670 Multicore Device

2013-07-12 06:50:38| rfglobalnet News Articles

Spectrum Signal Processing by Vecima, trusted supplier of embedded processing, RF and I/O solutions, today announced the XMC-8320 digital signal processing (DSP) engine that features two TMS320C6670 radio system-on-chip (SoC) multicore devices from Texas Instruments (TI).

Tags: features latest processing device

 

Spectrum's Latest XMC-8320 Dual Multicore DSP Processing Module Features TI's Fixed-Point And Floating-Point C6670 Multicore Device

2013-07-12 06:50:38| wirelessdesignonline News Articles

Spectrum Signal Processing by Vecima, trusted supplier of embedded processing, RF and I/O solutions, today announced the XMC-8320 digital signal processing (DSP) engine that features two TMS320C6670 radio system-on-chip (SoC) multicore devices from Texas Instruments (TI).

Tags: features latest processing device

 
 

Multi-Core Communications Processor delivers scalable performance.

2013-06-18 14:29:20| Industrial Newsroom - All News for Today

With quad-issue, quad-threading, advanced out-of-order execution architecture with multi-chip coherency, XLP900 Series delivers over one trillion operations per second of compute performance. It is manufactured in 28 nm and meets network performance, security, efficiency, and scalability requirements. Features include end-to-end virtualization, security capabilities, as well as network and application intelligence technology with wire-speed networking and multi-layer QoS capabilities. This story is related to the following:Communications Processors

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Multicore ARM® SBCs combine graphics, industrial I/O.

2013-05-08 14:30:59| Industrial Newsroom - All News for Today

Available with single-, dual-, or quad-core Freescale™ i.MX 6 series Cortex™-A9 processors, 800 MHz SBC35-C398 series has 102 x 146 mm footprint and operates from 10–50 Vdc or PoE input. Video engines can drive 3 simultaneous display interfaces while maintaining communications and control functions. I/O options include Gigabit Ethernet with IEEE-1588™ support, USB 2.0, serial, and CAN interfaces. IO60 connector, supporting I²C, SPI, TTL-UART, and PWM signals, allows stackable expansion. This story is related to the following:Single Board Computers

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Multimedia Framework increases multicore system efficiency.

2013-05-01 14:26:30| Industrial Newsroom - All News for Today

Android Multimedia Framework (AMF™) addresses intensive, real-time signal processing applications, including audio, voice, imaging, and vision, and seamlessly offloads related tasks from CPU to CEVA DSPs at Android OS level. Heterogeneous CPU and DSP system architecture reduces power consumption required for complex multimedia processing. Availability covers CEVA-TeakLite-4 audio/voice DSP, CEVA-MM3101 imaging and vision platform, and CEVA-X general purpose DSP. This story is related to the following:Central Processing Unit (CPU), Intellectual Property (IP), Microprocessor & Processor Cores

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