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TOP NEWS: Detroit Automaker Challenges Still Remain
2013-07-08 09:00:55| AutomotiveDigest.com - Automotive Industry News
Despite all the success American automakers have found in the last couple of years, serious challenges remain for the auto industry and must be addressed. The National Highway Traffic Safety Administration will soon complete an enormous database of all U.S. vehicles that have been either recalled or fixed. The latest vehicle technology aimed at saving lives is not just optional on high-end luxury models, but it is here and now for most consumers who want it.The Article TOP NEWS: Detroit Automaker Challenges Still Remain appeared first on Automotive Digest.
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3 Challenges American Automakers Face
2013-07-08 09:00:41| AutomotiveDigest.com - Automotive Industry News
Despite the recent success of the auto industry as a whole, there are still many issues and challenges that remain for the so-called Detroit automakers. Learn more about the top 3 problems these automakers currently face. [More]The Article 3 Challenges American Automakers Face appeared first on Automotive Digest.
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China Airlines challenges China Southern Airlines on the route from Taipei to Urumqi
2013-07-03 16:15:26| Airlines - Topix.net
China Airlines became the second Chinese carrier to operate the 3,700-kilometre route from Taipei Taoyuan to Urumqi , when it launched its thrice-weekly service on 25 June.
Ubuntu 13 challenges Windows 8
2013-07-01 12:00:00| Network World Clear Choice Tests
The latest version of Ubuntu, Raring Ringtail, is billed as business and user-friendly. There are still significant obstacles to its widespread adoption in the enterprise, but if your employees only access applications via the browser, and your company doesn't use complex spreadsheet macros or document formats, then Ubuntu 13 might be worth considering.
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Nihon Superior to Address Soldering Challenges at NEPCON South China
2013-07-01 06:00:00| Industrial Newsroom - All News for Today
OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental ...This story is related to the following:Green & CleanSearch for suppliers of: Lead-Free Solder | Soldering Flux | Electrical Solder |
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