je.st
news
Tag: promotes
PRESS RELEASE: Thornton Tomasetti Promotes David Weihing to Principal in Chicago Office
2013-09-12 18:39:00| National Real Estate Investor
Lindsay Church The Thornton Tomasetti board of directors and managing principals announced the promotion of David Weihing to principal in the Chicago office of the international engineering firm. read more
Tags: office
press
david
release
PRESS RELEASE: Thornton Tomasetti Promotes Torsten Gottlebe to Vice President in the Pacific Rim Group
2013-09-12 18:35:00| National Real Estate Investor
Lindsay Church The Thornton Tomasetti board of directors and managing principals announced the promotion of Torsten Gottlebe, P.E., to vice president in the Pacific Rim group of the international engineering firm. He is based in the firm's New York office. read more
Tags: group
press
release
president
Green Floor Sealer Promotes Durability
2013-09-11 06:00:00| Industrial Newsroom - All News for Today
Floor sealers have an important role to play in floorcare. ES 82 Barricade Sealer/Floor Finish from Enviro-Solutions is a blend of acrylic polymers that provides excellent protective properties to help prevent floor staining and soiling. ES 82 has excellent durability and is ideal for scrubbing, recoating, and spray buffing with machines up to 1,000 rpm.<br /> <br /> This cost-effective product is also UL approved for slip resistance to help promote safety and is nontoxic, biodegradable, and ...This story is related to the following:Paints and CoatingsFloor Sealers |
Tags: green
floor
promotes
durability
US: Stuart Weitzman promotes Kulkin to CEO
2013-09-10 16:23:00| Daily apparel & textile news and comment - from just-style.com
Stuart Weitzman, a division of The Jones Group, has promoted vice chairman Wayne Kulkin to chief executive officer as the footwear brand unveiled its latest expansion plans.
Via-Filling Process promotes 3D-IC/TSV packaging reliability.
2013-09-09 14:30:32| Industrial Newsroom - All News for Today
Available on EVG100 resist processing systems, NanoFill™ polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. This suits polymeric dielectrics, offering flexible, production-ready platform for interposer development. Without forming voids or cavities, solution provides complete via filling for permanent passivation and planarization. Sidewall passivation option lends to throughput benefits for select applications. This story is related to the following:Void Fillers
Tags: process
packaging
reliability
promotes
Sites : [150] [151] [152] [153] [154] [155] [156] [157] [158] [159] [160] [161] [162] [163] [164] [165] [166] [167] [168] [169] next »