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PRESS RELEASE: Thornton Tomasetti Promotes David Weihing to Principal in Chicago Office

2013-09-12 18:39:00| National Real Estate Investor

Lindsay Church The Thornton Tomasetti board of directors and managing principals announced the promotion of David Weihing to principal in the Chicago office of the international engineering firm. read more

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PRESS RELEASE: Thornton Tomasetti Promotes Torsten Gottlebe to Vice President in the Pacific Rim Group

2013-09-12 18:35:00| National Real Estate Investor

Lindsay Church The Thornton Tomasetti board of directors and managing principals announced the promotion of Torsten Gottlebe, P.E., to vice president in the Pacific Rim group of the international engineering firm. He is based in the firm's New York office. read more

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Green Floor Sealer Promotes Durability

2013-09-11 06:00:00| Industrial Newsroom - All News for Today

Floor sealers have an important role to play in floorcare. ES 82 Barricade Sealer/Floor Finish from Enviro-Solutions is a blend of acrylic polymers that provides excellent protective properties to help prevent floor staining and soiling. ES 82 has excellent durability and is ideal for scrubbing, recoating, and spray buffing with machines up to 1,000 rpm.<br /> <br /> This cost-effective product is also UL approved for slip resistance to help promote safety and is nontoxic, biodegradable, and ...This story is related to the following:Paints and CoatingsFloor Sealers |

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US: Stuart Weitzman promotes Kulkin to CEO

2013-09-10 16:23:00| Daily apparel & textile news and comment - from just-style.com

Stuart Weitzman, a division of The Jones Group, has promoted vice chairman Wayne Kulkin to chief executive officer as the footwear brand unveiled its latest expansion plans.

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Via-Filling Process promotes 3D-IC/TSV packaging reliability.

2013-09-09 14:30:32| Industrial Newsroom - All News for Today

Available on EVG100 resist processing systems, NanoFill&trade; polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. This suits polymeric dielectrics, offering flexible, production-ready platform for interposer development. Without forming voids or cavities, solution provides complete via filling for permanent passivation and planarization. Sidewall passivation option lends to throughput benefits for select applications. This story is related to the following:Void Fillers

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