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Tag: fraunhofer
Johnson Controls and Fraunhofer Gesellschaft collaborate on next-gen cooling systems for Li-ion battery packs; focus on 48V micro-hybrid system
2014-03-20 20:30:52| Green Car Congress
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Fraunhofer ESK demonstrating vehicle-to-grid communications based on ISO/IEC 15118 and IEC 61850 standards
2014-02-13 15:31:31| Green Car Congress
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EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced ...
2014-01-14 06:00:00| Industrial Newsroom - All News for Today
EVG® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices<br /> <br /> ST. FLORIAN, Austria – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG® 850TB/DB fully automated bonding/debonding equipment ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category SponsorWafer Processing Systems | Bonding Machinery | Wafer Coating Equipment
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SUSS MicroTec Installs ELP300 Excimer Laser Stepper At Fraunhofer IZM Berlin
2013-11-21 07:37:58| chemicalonline News Articles
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.
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SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM Berlin
2013-11-20 06:00:00| Industrial Newsroom - All News for Today
Garching – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing and processing of 100mm to 300mm wafers. The platform ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdWafer Processing Systems | Laser Machining |
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