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3D IC and TSV Interconnect Market Worth $6.55 billion by 2016 - Report by MarketsandMarkets
2014-03-23 16:24:44| Semiconductors - Topix.net
March 23, 2014 According to a new market research report "Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market - Global Forecast & Trend Analysis By Technology , Products & Applications ", the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016.
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Category:Electronics and Electrical
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