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Advanced Reflow Systems include batch ovens and inline variants.

2014-03-10 13:30:42| Industrial Newsroom - All News for Today

Via combination of hot air reflow, nitrogen purge, and heat circulation vacuum, Eightech Vacuum Reflow RNV Series can reduce presence of solder joint voids when soldering larger PCBs and area-array packages. Flux-free soldering, accomplished by utilizing vacuum reflow in combination with hydrogen/formic acid, provides such benefits as no-flux wash process, minimized influences on insulation resistance and ion migration, as well as void-free soldering. This story is related to the following:Materials and Material Processing Sponsored by: EXAIR Corporation - Category Sponsor March14Search for suppliers of: Solder Reflow Systems |

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