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Batch Wet Processing System optimizes metal lift-off.

2014-03-21 13:30:57| Industrial Newsroom - All News for Today

Using patented batch immersion processing for metal lift-off in MEMS and compound semiconductor manufacturing, FluidJet™ System produces no metal redeposition on either front side or back side of wafer, eliminating device damage while minimizing chemical use. Self cleaning tanks and metal collection baskets enable lifted metals to be completely reclaimed. Emptied in minutes, strainer baskets are sized to hold several thousand wafers worth of lifted metal. This story is related to the following:Semiconductor Processing Equipment

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Category:Industrial Goods and Services

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