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Home › Debonding Processes promote manufacturing flexibility.

 

Debonding Processes promote manufacturing flexibility.

2013-07-09 14:31:03| Industrial Newsroom - All News for Today

LowTemp™ debonding platform features 3 room-temperature wafer debonding processes and extended material supply chain. Two debonding processes have been qualified for EVG high-volume production temporary bonding/debonding (TB/DB) systems – UV laser debonding and multilayer adhesive debonding – in addition to ZoneBOND® technology, which has been implemented into production across compound semiconductor and advanced packaging markets. This story is related to the following:Cyanoacrylate Debonders |

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Category:Industrial Goods and Services

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