Optimized for hot roll lamination and processing on micro-electromechanical systems (MEMS) and IC wafers, DF-4017 produces hydrophobic (>90° contact angle) film surfaces. Cured chemistry withstands harsh environments, including those subject to moisture and corrosive chemicals, while glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C lend to toughness. Product is compatible with and can be used in contact with EMS spin coating photoresist.
This story is related to the following:Photoresists