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Home › EV Group Extends Wafer Bonding Equipment And Process Solutions For Covalent Bonding Technology

 

EV Group Extends Wafer Bonding Equipment And Process Solutions For Covalent Bonding Technology

2013-03-08 02:00:51| metrologyworld News Articles

EV Group (EVG),a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature

Tags: group technology process equipment

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