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Electroplating Systems utilize 3 modular processing chambers.

2016-03-28 14:31:07| Industrial Newsroom - All News for Today

Available for ≤200 mm Solstice® Electroplating Systems, Plating-Plus™ capability allows additional processes to be integrated into single plating tool. High-Pressure Metal Lift-Off chamber enables high-efficiency metal removal without redeposition, while Resist Strip chamber handles solvents safely and can run single stripping process across different resists. UBM Etch Chamber incorporates intelligent optical end-point detection technology that controls etching to avoid undercut.

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Category:Industrial Goods and Services

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