Home › Encapsulant/Adhesive suits printer head, circuit assembly jobs.
 

Keywords :   


Encapsulant/Adhesive suits printer head, circuit assembly jobs.

2013-06-20 14:29:17| Industrial Newsroom - All News for Today

Exhibiting fracture toughness as well as chemical resistance to inks, 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. Product adheres to flexible circuits, FR4, and metal substrates and meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments. This story is related to the following:Computer Hardware and PeripheralsAdhesives and SealantsBonding Wire | Silicone Encapsulants | Flexible Joint Bonding Adhesives | Adhesive Assembly Circuits

Tags: jobs head printer assembly

Category:Industrial Goods and Services

Latest from this category

All news
31.10Consolidated Financial Statements for the six-month period ended September 30, 2024
31.10Notice regarding the revision of the business results forecasts
Industrial Goods and Services »
08.11Tech giants dominate U.S. streaming platform market
08.11Warner Bros. Discovery adds 7.2 million DTC subscribers in 3Q 2024
08.11Polyurea-Based Lining is Key to GRE Pipeline Rehab Project in UAE
08.11Parents paying over the odds for baby milk, watchdog warns
08.11Sports fans driving global growth in streaming services
08.11TiVo OS footprint approaching one million activated Smart TVs
08.11The Entertainer axes new shops after Budget tax rise
08.11Hurricane Rafael Graphics
More »