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Heat Sinks with Low Thermal Resistance

2013-02-13 12:20:28| rfglobalnet Products

Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.

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