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Heat Sinks with Low Thermal Resistance

2013-02-13 12:20:28| dairynetwork Home Page

Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.

Tags: low heat resistance thermal

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