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Heidelberg Instruments Provides Lithography Platform for Wafer Level Packaging

2013-11-19 06:00:00| Industrial Newsroom - All News for Today

Heidelberg, Germany – Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from a leading Asian based semiconductor packaging group. System will be used in production of advanced semiconductor and wafer level packaging devices used in the production of consumer products such as Smartphones,Tablets, Ultrabooks, e-Readers, GPS, Portable Game Consoles, Camcorders and LCD ...This story is related to the following:Lithographic Equipment & Supplies

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Category:Industrial Goods and Services

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