Released by IPC, "Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications" assesses current and future state of lead-free usage in high-reliability applications. Examination of various tipping points and other indicators is used as basis for 10-year forecast of ratio of tin/lead to lead-free solder consumption (worldwide and in North America). Study provides look at how manufacturers are coping with such problems and how this trend will affect industry's future.