Produced in 0.35 micron HV-CMOS technology, Model MLX80002/4 combines 2 or 4 LIN transceivers, respectively, on one die, enabling development of multi-LIN network master modules. Device features integrated 1 kΩ LIN master termination resistors and decoupling diodes, meets automotive temperature range of -40°C to +125°C, and has on-chip protection against over-temperature, 40 V load dump, and LIN short to ground. For data transmission according SAEJ2602, special low slew mode is available.
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