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Low-Profile, High Density Interposers provide design flexibility.

2015-03-27 13:31:08| Industrial Newsroom - All News for Today

Used as interposers or integrated into connector housings, Z-Ray™ 0.80 mm pitch, one-piece compression contact arrays offer 28+ Gbps performance. ZA8 Series, available with choice of dual compression contacts or single compression with solder balls, has up to 400 total BeCu micro-formed contacts and features 25 g normal force with .008 in. contact deflection. Available in customizable shapes and patterns, products are optimized for density, X/Y/Z axis flexibility, and cycle life.

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Category:Industrial Goods and Services

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