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Open Pin Field Arrays deliver high-speed performance.

2013-07-08 14:29:29| Industrial Newsroom - All News for Today

High-density LP Array™ (LPAM and LPAF Series) supports high-speed applications that require reliable, high-pin count solutions in low-profile design. Available in 4, 4.5, and 5 mm mated heights with up to 180 total pins in 4 or 6 row configurations, arrays feature dual wipe contact system on 1.27 x 1.27 mm pitch grid for maximum grounding and routing flexibility. Lead-free solder crimp terminations facilitate processing, and tin-lead solder crimp is also available. This story is related to the following:Electrical Equipment and Systems Sponsored by: Globtek Inc. - MOBILE BANNER ADSurface Mount Connectors | Computer & Electronic Equipment Connectors | Arrays | Transistor Arrays |

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