Home › Researchers create new sensor circuit to test food packaging
 

Keywords :   


Researchers create new sensor circuit to test food packaging

2013-02-28 01:00:00| Packaging Gateway

Netherlands-based Eindhoven University of Technology (TU/e), Universitá di Catania in Italy, France-based laboratory CEA-Liten and semiconductors manufacturer STMicroelectronics have created a circuit that tests the expiry date on food packaging.

Tags: create test food circuit

Category:Industrial Goods and Services

Latest from this category

All news
19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
24.11 Beautiful World CD
24.11VIII
24.11PLUS MADHOUSE( ) 2
24.11KATO 10-1537 415
24.11125f-slim
24.11
24.11olend ona soft bag
24.1110ONKYO
More »