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Rogers Corporation's Advanced Circuit Materials Division Announces RO3000 Laminates With Rolled Copper Foils

2014-09-25 08:09:06| rfglobalnet Home Page

Rogers Corporation’s Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003, RO3035 and RO3203 low dielectric constant laminate materials.

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