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Rudolph Announces New SONUS Technology And Collaboration With TEL NEXX For Advanced Packaging Process Control
2014-08-07 10:37:33| metrologyworld Home Page
Rudolph Technologies, Inc. announced recently the availability of its new SONUS Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs)
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Category:Industrial Goods and Services
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