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Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
2013-05-02 06:00:00| Industrial Newsroom - All News for Today
• Validates commercialization of revolutionary 2X stepper total lithography solution<br /> • Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process<br /> <br /> Flanders, New Jersey – Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, announced today that the first of its new JetStep™ ...This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesPrinting and Duplicating EquipmentSearch for suppliers of: Wafer Processing Systems | Photolithography Equipment & Supplies | Lithographic Equipment & Supplies
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