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Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process ...
Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process ...
2014-02-11 06:00:00| Industrial Newsroom - All News for Today
First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration<br /> <br /> Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute (Nanoelec RTI) program, is developing three-dimensional ...This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Printed Circuit Board (PCB) Inspection Systems
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