Home › Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process ...
 

Keywords :   


Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for through Silicon Via Process ...

2014-02-11 06:00:00| Industrial Newsroom - All News for Today

First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration<br /> <br /> Flanders, New Jersey &mdash; Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute (Nanoelec RTI) program, is developing three-dimensional ...This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Printed Circuit Board (PCB) Inspection Systems

Tags: system via process ships

Category:Industrial Goods and Services

Latest from this category

All news
15.09Your MANA RepFinder Profile
Industrial Goods and Services »
28.09Eastern North Pacific Tropical Weather Outlook
28.09Atlantic Tropical Weather Outlook
28.09Post-Tropical Cyclone Helene Public Advisory Number 21
28.09Tropical Storm Joyce Public Advisory Number 5
28.09Summary for Tropical Storm Joyce (AT1/AL112024)
28.09Post-Tropical Cyclone Helene Public Advisory Number 21
28.09Tropical Storm Joyce Forecast Discussion Number 5
28.09Tropical Storm Joyce Wind Speed Probabilities Number 5
More »