Home › STMicroelectronics Paves The Way To Next-Generation High-Speed Broadband Experiences With Successful DOCSIS 3.1 And RDK-B Demonstration
 

Keywords :   


STMicroelectronics Paves The Way To Next-Generation High-Speed Broadband Experiences With Successful DOCSIS 3.1 And RDK-B Demonstration

2015-01-06 04:25:27| rfglobalnet Home Page

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is previewing a new high-performance DOCSIS 3.1 platform in a live demonstration in Las Vegas during the Consumer Electronics Show.

Tags: successful experiences broadband demonstration

Category:Telecommunications

Latest from this category

All news
»
18.05Eastern North Pacific Tropical Weather Outlook
18.05Atlantic Tropical Weather Outlook
18.05Producers to be paid grid premiums for AngusLink beef scores
18.05This Week in Agribusiness, May 18, 2024
18.05This Week in Agribusiness, May 18, 2024
18.05Unpaid carers being forced to repay 250m to DWP
18.05Weekly Recap: Hempel, Axalta, KANSAI HELIOS Top This Weeks Stories
18.05Eastern North Pacific Tropical Weather Outlook
More »