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Semiconductor Processing Tool minimizes plama-induced damage.

2014-07-10 14:30:59| Industrial Newsroom - All News for Today

Targeted for 2xnm and below etch applications, Primo iDEA™ integrates 4 dielectric etch stations and 2 photoresist strip chambers onto same platform. Integrative approach enables optimization of each process step and minimizes risk of plasma-induced damage. With dedicated dielectric etch and downstream ashing capabilities, offering is optimal for FEOL and BEOL applications involved in volume-producing complex, extremely small devices that are highly sensitive to manufacturing stresses. This story is related to the following:Semiconductor Processing Equipment | Plasma Etching Systems

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