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Semiconductor Test Probe meets HED device testing challenges.

2015-09-02 14:31:03| Industrial Newsroom - All News for Today

With 5.0 mm test height that provides total compression window of 0.8 mm and insertion loss of 18 GHz @ -1 dB (GSG), ZIP™ semiconductor test probe model Z-080YHJ targets high-lead count BGAs and LGAs and meets challenges associated with testing High End Digital (HED) devices. DUT side plunger, which is made from HyperCore™ homogenous alloy, features sharp, dual tip geometry for facilitated penetration of solder ball oxides. Product is based on flat probe technology.

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Category:Industrial Goods and Services

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