Available as 1.0 mm thick sheet, Sarcon® XR-Pe delivers thermal conductivity of 11 W/m°K with thermal resistance as low as .06°C in.²/W. Silicone-based material conforms to most CPU and semiconductor shapes with minimal compression force requirement, and soft-touch characteristic is maintained for applications that require material compression from 30%–90%. Supporting use from -40 to +150°C, material helps improve semiconductor performance by transferring unwanted heat to nearby heat sink.
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