With low-viscosity formula that facilitates dispensing, SARCON® SPG-20B delivers thermal conductivity of 2.1 W/m°K and thermal resistance of 1.8°C cm²/W. This form-in-place thermal interface compound, when applied between heat-generating component and nearby heat sink or spreader, completely fills all unwanted gaps. Form-stable solution does not require any heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties from -40 to +150°C.
This story is related to the following:Chemical Processing and Waste ManagementSearch for suppliers of: Silicone Conductive Compounds