TE Connectivity , a world leader in connectivity, announced today a plan to create a standard for a new 100Gb/s form factor pluggable interconnect with the functionality of QSFP28 in a thermally enhanced package approximately the size of the SFP form factor by way of a new MSA group. 'Customers are looking for a smaller form factor that will offer increased faceplate density and higher aggregate bandwidth, while still maintaining superior thermal performance,' reports Nathan Tracy, technologist, TE Data Communications.