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Home › Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

 

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

2014-07-08 02:45:10| Semiconductors - Topix.net

This release expands on Teradyne's market-leading position by introducing a new RF instrument, the UltraWave24, a new DSP Processor, the UltraDSP1, and the latest version of the Enhanced Signal Analyzer Toolkit.

Tags: test solution generation wireless

Category:Electronics and Electrical

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