Home Thermal Compound supports form-in-place gap filling.
 

Keywords :   


Thermal Compound supports form-in-place gap filling.

2015-09-30 14:31:07| Industrial Newsroom - All News for Today

Capable of filling large gaps around fragile circuit board solder points without causing damage or loss in performance, 5.0 W/m°K SARCON® SPG-50A facilitates efficient transfer of heat from any board-level source to nearby heat sink or heat spreader. Silicon based material provides optimized vibration absorption capabilities and maintains all initial properties across wide temperature range of -40 to +150°C. Compound is available in tubes or syringes.

Tags: supports gap thermal filling

Category:Industrial Goods and Services

Latest from this category

All news

31.10Consolidated Financial Statements for the six-month period ended September 30, 2024
31.10Notice regarding the revision of the business results forecasts
Industrial Goods and Services »
05.11Boeing strike ends as workers back 38% pay rise deal
05.11Tropical Storm Rafael Public Advisory Number 6A
05.11Summary for Tropical Storm Rafael (AT3/AL182024)
05.11Tropical Storm Rafael Graphics
05.11Atlantic Tropical Weather Outlook
05.11Eastern North Pacific Tropical Weather Outlook
05.11Tropical Storm Rafael Graphics
05.11Tropical Storm Rafael Forecast Discussion Number 6
More »