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Thermal Compound supports form-in-place gap filling.

2015-09-30 14:31:07| Industrial Newsroom - All News for Today

Capable of filling large gaps around fragile circuit board solder points without causing damage or loss in performance, 5.0 W/m°K SARCON® SPG-50A facilitates efficient transfer of heat from any board-level source to nearby heat sink or heat spreader. Silicon based material provides optimized vibration absorption capabilities and maintains all initial properties across wide temperature range of -40 to +150°C. Compound is available in tubes or syringes.

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Category:Industrial Goods and Services

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